{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,7,23]],"date-time":"2024-07-23T04:32:58Z","timestamp":1721709178961},"reference-count":21,"publisher":"MDPI AG","issue":"5","license":[{"start":{"date-parts":[[2016,5,5]],"date-time":"2016-05-05T00:00:00Z","timestamp":1462406400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"This paper presents a bistable microswitch fully batch-fabricated on a single glass wafer, comprising of a microactuator, a signal transformer, a microspring and a permanent magnet. The bistable mechanism of the microswitch with large displacement of 160 \u03bcm depends on the balance of the magnetic force and elastic force. Both the magnetic force and elastic force were optimized by finite-element simulation to predict the reliable of the device. The prototype was fabricated and characterized. By utilizing thick laminated photoresist sacrificial layer, the large displacement was obtained to ensure the insulation of the microswitch. The testing results show that the microswitch realized the bistable mechanism at a 3\u20135 V input voltage and closed in 0.96 ms, which verified the simulation.<\/jats:p>","DOI":"10.3390\/s16050634","type":"journal-article","created":{"date-parts":[[2016,5,6]],"date-time":"2016-05-06T14:19:23Z","timestamp":1462544363000},"page":"634","source":"Crossref","is-referenced-by-count":6,"title":["Large Out-of-Plane Displacement Bistable Electromagnetic Microswitch on a Single Wafer"],"prefix":"10.3390","volume":"16","author":[{"given":"Xiaodan","family":"Miao","sequence":"first","affiliation":[{"name":"College of Mechanical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China"}]},{"given":"Xuhan","family":"Dai","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Micro\/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}]},{"given":"Yi","family":"Huang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Micro\/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}]},{"given":"Guifu","family":"Ding","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Micro\/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}]},{"given":"Xiaolin","family":"Zhao","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Micro\/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}]}],"member":"1968","published-online":{"date-parts":[[2016,5,5]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"135","DOI":"10.1016\/0924-4247(96)01274-5","article-title":"Future of micro-electromechanical systems","volume":"56","author":"Bao","year":"1996","journal-title":"Sens. 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