{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T14:56:22Z","timestamp":1740149782822,"version":"3.37.3"},"reference-count":43,"publisher":"MDPI AG","issue":"2","license":[{"start":{"date-parts":[[2020,2,19]],"date-time":"2020-02-19T00:00:00Z","timestamp":1582070400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"the National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51671125"],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Entropy"],"abstract":"In this study, high-entropy alloy films, namely, AlCrTaTiZr\/AlCrTaTiZr-N, were deposited on the n-type (100) silicon substrate. Then, a copper film was deposited on the high-entropy alloy films. The diffusion barrier performance of AlCrTaTiZr\/AlCrTaTiZr-N for Cu\/Si connect system was investigated after thermal annealing for an hour at 600 \u00b0C, 700 \u00b0C, 800 \u00b0C, and 900 \u00b0C. There were no Cu-Si intermetallic compounds generated in the Cu\/AlCrTaTiZr\/AlCrTaTiZr-N\/Si film stacks after annealing even at 900 \u00b0C through transmission electron microscopy (TEM) and atomic probe tomography (APT) analysis. The results indicated that AlCrTaTiZr\/AlCrTaTiZr-N alloy films can prevent copper diffusion at 900 \u00b0C. The reason was investigated in this work. The amorphous structure of the AlCrTaTiZr layer has lower driving force to form intermetallic compounds; the lattice mismatch between the AlCrTaTiZr and AlCrTaTiZ-rN layers increased the diffusion distance of the Cu atoms and the difficulty of the Cu atom diffusion to the Si substrate.<\/jats:p>","DOI":"10.3390\/e22020234","type":"journal-article","created":{"date-parts":[[2020,2,20]],"date-time":"2020-02-20T08:20:03Z","timestamp":1582186803000},"page":"234","source":"Crossref","is-referenced-by-count":30,"title":["Diffusion Barrier Performance of AlCrTaTiZr\/AlCrTaTiZr-N High-Entropy Alloy Films for Cu\/Si Connect System"],"prefix":"10.3390","volume":"22","author":[{"given":"Chunxia","family":"Jiang","sequence":"first","affiliation":[{"name":"School of Materials Science and Engineering, Shanghai Dianji University, Shanghai 201306, China"}]},{"given":"Rongbin","family":"Li","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Shanghai Dianji University, Shanghai 201306, China"}]},{"given":"Xin","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Shanghai Dianji University, Shanghai 201306, China"}]},{"given":"Hailong","family":"Shang","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Shanghai Dianji University, Shanghai 201306, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6355-9923","authenticated-orcid":false,"given":"Yong","family":"Zhang","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0185-3411","authenticated-orcid":false,"given":"Peter K.","family":"Liaw","sequence":"additional","affiliation":[{"name":"Department of Materials Science and Engineering, The University of Tennessee, Knoxville, TN 37996, USA"}]}],"member":"1968","published-online":{"date-parts":[[2020,2,19]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"922","DOI":"10.1149\/1.2069326","article-title":"Electrical properties of giant-grain copper thin films formed by a low kinetic energy particle process","volume":"139","author":"Nitta","year":"1992","journal-title":"J. Electrochem Soc."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"2754","DOI":"10.1063\/1.101944","article-title":"Outdiffusion of Cu through Au: Comparison of (100) and (111)\u2009Cu films epitaxially deposited on Si, and effects of annealing ambients","volume":"55","author":"Chang","year":"1989","journal-title":"Appl. Phys. Lett."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"450","DOI":"10.1016\/S0169-4332(01)00916-3","article-title":"High performance of thin nano-crystalline ZrN diffusion barriers in Cu\/Si contact systems","volume":"190","author":"Takeyama","year":"2002","journal-title":"Appl. Surf. Sci."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"6","DOI":"10.1016\/S0040-6090(03)01384-1","article-title":"Investigation on diffusion barrier properties of reactive sputter deposited TiAlxNyOz, thin films for Cu metallization","volume":"449","author":"Kim","year":"2004","journal-title":"Thin Solid Films"},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"170","DOI":"10.1016\/S0040-6090(96)08553-7","article-title":"WNx diffusion barriers between Si and Cu","volume":"286","author":"Uekubo","year":"1996","journal-title":"Thin Solid Films"},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"111917","DOI":"10.1063\/1.2901035","article-title":"Ir\/TaN as a bilayer diffusion barrier for advanced Cu interconnects","volume":"92","author":"Leu","year":"2008","journal-title":"Appl. Phy. Lett."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"303","DOI":"10.1038\/366303a0","article-title":"Confusion by design","volume":"366","author":"Greer","year":"1993","journal-title":"Nature"},{"key":"ref_8","first-page":"17","article-title":"A highly processable metallic glass: Zr[sub 41.2]Ti[sub 13.8]Cu[sub 12.5]Ni[sub 10.0]Be[sub 22.5]","volume":"63","author":"Peker","year":"1993","journal-title":"Appl. Phys. Lett."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"1799","DOI":"10.1351\/pac200072101799","article-title":"Challenges and Opportunities in Solid-State Chemistry","volume":"72","author":"Disalvo","year":"2000","journal-title":"Pure Appl. Chem."},{"key":"ref_10","first-page":"1","article-title":"Improved tensile properties of Al0.5CoCrFeNi high-entropy alloy by tailoring microstructures","volume":"8","author":"Niu","year":"2017","journal-title":"Rare Met."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"1465","DOI":"10.1007\/s11661-004-0254-x","article-title":"Wear resistance and high-temperature compression strength of FCC CuCoNiCrAl0.5 Fe alloy with boron addition","volume":"35","author":"Hsu","year":"2004","journal-title":"Metall. Mater. Trans. A"},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"839","DOI":"10.1007\/s11837-012-0365-6","article-title":"Computational Thermodynamics Aided High-Entropy Alloy Design","volume":"64","author":"Zhang","year":"2012","journal-title":"JOM"},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"258","DOI":"10.1016\/j.actamat.2015.06.025","article-title":"Mechanical properties, microstructure and thermal stability of a nanocrystalline CoCrFeMnNi high-entropy alloy after severe plastic deformation","volume":"96","author":"Schuh","year":"2015","journal-title":"Acta Mater."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"H1161","DOI":"10.1149\/2.056111jes","article-title":"Thermal Stability and Performance of NbSiTaTiZr High-Entropy Alloy Barrier for Copper Metallization","volume":"158","author":"Tsai","year":"2011","journal-title":"J. Electrochem. Soc."},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"182503-1","DOI":"10.1063\/1.2372746","article-title":"Hyperfine splitting from magnetic boride domains embedded in Fe-Co-Ni-Al-B-Si alloy","volume":"89","author":"Kuo","year":"2006","journal-title":"Appl. Phys. Lett."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1016\/j.pmatsci.2013.10.001","article-title":"Microstructures and properties of high-entropy alloys","volume":"61","author":"Zhang","year":"2014","journal-title":"Pro. Mater Sci."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"448","DOI":"10.1016\/j.actamat.2016.08.081","article-title":"A critical review of high entropy alloys (HEAs) and related concepts","volume":"122","author":"Miracle","year":"2017","journal-title":"Acta Mater."},{"key":"ref_18","first-page":"1","article-title":"Amorphous phase stability of NbTiAlSiNX, high-entropy films","volume":"5","author":"Sheng","year":"2017","journal-title":"Rare Met."},{"key":"ref_19","first-page":"633","article-title":"Recent progress in high-entropy alloys","volume":"31","author":"Yeh","year":"2006","journal-title":"Eur. J. Cont."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"789","DOI":"10.1016\/j.apsusc.2013.06.057","article-title":"Structural morphology and characterization of (AlCrMoTaTi)N coating deposited via magnetron sputtering","volume":"282","author":"Tsai","year":"2013","journal-title":"Appl. Surf. Sci."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"1891","DOI":"10.1016\/j.surfcoat.2009.01.016","article-title":"Effects of nitrogen content on structure and mechanical properties of multi-element (AlCrNbSiTiV) N coating","volume":"203","author":"Huang","year":"2009","journal-title":"Surf. Coat. Technol."},{"key":"ref_22","doi-asserted-by":"crossref","unstructured":"Sheng, W., Yang, X., Wang, C., and Yong, Z. (2016). Nano-Crystallization of High-Entropy Amorphous NbTiAlSiWxNy Films Prepared by Magnetron Sputtering. Entropy, 18.","DOI":"10.3390\/e18060226"},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"293","DOI":"10.1016\/j.surfcoat.2012.07.004","article-title":"Effects of substrate bias on structure and mechanical properties of (TiVCrZrHf)N coatings","volume":"207","author":"Tsai","year":"2012","journal-title":"Surf. Coat. Technol."},{"key":"ref_24","doi-asserted-by":"crossref","first-page":"264","DOI":"10.1016\/j.ijplas.2017.04.013","article-title":"Size effects on the mechanical properties of nanocrystalline NbMoTaW refractory high entropy alloy thin films","volume":"95","author":"Feng","year":"2017","journal-title":"Int. J. Plast."},{"key":"ref_25","first-page":"1196","article-title":"Effects of annealing on microstructure, mechanical and electrical properties of AlCrCuFeMnTi high entropy alloy. Journal of Wuhan University of Technology-Mater","volume":"28","author":"Nong","year":"2013","journal-title":"Sci. Ed."},{"key":"ref_26","doi-asserted-by":"crossref","first-page":"1997","DOI":"10.1016\/j.scriptamat.2006.03.021","article-title":"Selected corrosion behaviors of a Cu0.5 NiAlCoCrFeSi bulk glassy alloy in 288\u2103 high-purity water","volume":"54","author":"Chen","year":"2006","journal-title":"Scripta Mater."},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"4","DOI":"10.1016\/j.jallcom.2011.11.082","article-title":"4-nm thick multilayer structure of multi-component (AlCrRuTaTiZr)Nx, as robust diffusion barrier for Cu interconnects","volume":"515","author":"Chang","year":"2012","journal-title":"J. Alloys Compd."},{"key":"ref_28","doi-asserted-by":"crossref","first-page":"052109-1","DOI":"10.1063\/1.2841810","article-title":"Thermally stable amorphous (AlMoNbSiTaTiVZr)50N50 nitride film as diffusion barrier in copper metallization","volume":"92","author":"Tsai","year":"2008","journal-title":"Appl. Phys. Lett."},{"key":"ref_29","doi-asserted-by":"crossref","first-page":"S348","DOI":"10.1016\/j.jallcom.2012.10.190","article-title":"Low resistivity Fe-Co-B-Ti-Nb amorphous thin film as a copper barrier","volume":"586","author":"Fang","year":"2014","journal-title":"J. Alloys Compd."},{"key":"ref_30","doi-asserted-by":"crossref","first-page":"1790","DOI":"10.1007\/s11837-013-0676-2","article-title":"Improved Diffusion-Resistant Ability of Multicomponent Nitrides: From Unitary TiN to Senary High-Entropy (TiTaCrZrAlRu)N","volume":"65","author":"Chang","year":"2013","journal-title":"JOM"},{"key":"ref_31","doi-asserted-by":"crossref","first-page":"3275","DOI":"10.1016\/j.surfcoat.2006.06.048","article-title":"Preparation and characterization of AlCrTaTiZr multi-element nitride coatings","volume":"201","author":"Lai","year":"2006","journal-title":"Surf. Coat. Technol."},{"key":"ref_32","doi-asserted-by":"crossref","first-page":"160","DOI":"10.1016\/j.surfcoat.2013.12.034","article-title":"Interfacial reactions and characterization of (TiVCrZrHf)N thin films during thermal treatment","volume":"240","author":"Tsai","year":"2014","journal-title":"Surf. Coat. Technol."},{"key":"ref_33","doi-asserted-by":"crossref","first-page":"4989","DOI":"10.1016\/j.tsf.2009.03.139","article-title":"Study on adhesion and wear resistance of multi-element (AlCrTaTiZr)N coatings","volume":"517","author":"Cheng","year":"2009","journal-title":"Thin Solid Films"},{"key":"ref_34","first-page":"374","article-title":"Investigation Status on Cu Interconnection and Its Key Technologies. Semicond","volume":"33","author":"Zhao","year":"2008","journal-title":"Sci. Technol."},{"key":"ref_35","doi-asserted-by":"crossref","first-page":"633","DOI":"10.1557\/jmr.2011.9","article-title":"Thermal strains in passivated aluminum and copper conductor lines","volume":"26","author":"Zhang","year":"2011","journal-title":"J. Mater. Res."},{"key":"ref_36","doi-asserted-by":"crossref","first-page":"2257","DOI":"10.1016\/j.corsci.2004.11.008","article-title":"Microstructure and electrochemical properties of high entropy alloys a comparison with type-304 stainless steel","volume":"47","author":"Chen","year":"2005","journal-title":"Shih Corros. Sci."},{"key":"ref_37","doi-asserted-by":"crossref","first-page":"L85","DOI":"10.1016\/j.jallcom.2010.11.124","article-title":"Ru incorporation on marked enhancement of diffusion resistance of multi-component alloy barrier layers","volume":"509","author":"Chang","year":"2011","journal-title":"J. Alloys Compd."},{"key":"ref_38","doi-asserted-by":"crossref","first-page":"1372","DOI":"10.2320\/matertrans1989.41.1372","article-title":"Mixing Enthalpy and Mismatch Entropy for Ternary Amorphous Alloys","volume":"41","author":"Takeuchi","year":"2000","journal-title":"Mater. Trans. JIM"},{"key":"ref_39","doi-asserted-by":"crossref","first-page":"2817","DOI":"10.2320\/matertrans.46.2817","article-title":"Classification of Bulk Metallic Glasses by Atomic Size Difference, Heat of Mixing and Period of Constituent Elements and Its Application to Characterization of the Main Alloying Element","volume":"46","author":"Takeuchi","year":"2005","journal-title":"Mater. Trans."},{"key":"ref_40","doi-asserted-by":"crossref","first-page":"279","DOI":"10.1016\/S1359-6454(99)00300-6","article-title":"Stabilization of metallic supercooled liquid and bulk amorphous alloys","volume":"48","author":"Inoue","year":"2000","journal-title":"Acta Mater."},{"key":"ref_41","unstructured":"Shewmon, P.G. (2000). Diffusion in Solids, The Minerals, Metals & Materials Society."},{"key":"ref_42","first-page":"419","article-title":"Effect of Si target sputtering power on diffusion barrier properies of Ta-Si-N thin-films, Mater","volume":"25","author":"Zhou","year":"2009","journal-title":"Sci. Technol."},{"key":"ref_43","doi-asserted-by":"crossref","first-page":"430","DOI":"10.1016\/j.jpcs.2007.07.046","article-title":"Evaluation of Properties of Ta-Ni amorphous thin film for copper metallization inintegrated circuits","volume":"69","author":"Fang","year":"2008","journal-title":"J. Phys. Chem. Solids"}],"container-title":["Entropy"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1099-4300\/22\/2\/234\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,6,24]],"date-time":"2024-06-24T15:41:22Z","timestamp":1719243682000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1099-4300\/22\/2\/234"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,2,19]]},"references-count":43,"journal-issue":{"issue":"2","published-online":{"date-parts":[[2020,2]]}},"alternative-id":["e22020234"],"URL":"https:\/\/doi.org\/10.3390\/e22020234","relation":{},"ISSN":["1099-4300"],"issn-type":[{"type":"electronic","value":"1099-4300"}],"subject":[],"published":{"date-parts":[[2020,2,19]]}}}