{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,7,15]],"date-time":"2024-07-15T13:15:20Z","timestamp":1721049320493},"reference-count":13,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"8","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2015]]},"DOI":"10.1587\/elex.12.20150118","type":"journal-article","created":{"date-parts":[[2015,4,3]],"date-time":"2015-04-03T16:07:28Z","timestamp":1428077248000},"page":"20150118-20150118","source":"Crossref","is-referenced-by-count":2,"title":["High-performance cost-efficient dual-band CMOS LC VCO"],"prefix":"10.1587","volume":"12","author":[{"given":"Zong-Yi","family":"Yang","sequence":"first","affiliation":[{"name":"Department of Electronics Engineering, National Yunlin University of Science and Technology"}]},{"given":"Roger Yubtzuan","family":"Chen","sequence":"additional","affiliation":[{"name":"Department of Electronics Engineering, National Yunlin University of Science and Technology"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] S.-M. Yim and K. K. O: IEEE Trans. Microw. Theory Tech. 54<\/b> (2006) 74. DOI:10.1109\/TMTT.2005.856102","DOI":"10.1109\/TMTT.2005.856102"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] N. T. Tchamov, S. S. Broussev, I. S. Uzunov and K. K. Rantala: IEEE Trans. Circuits Syst. II, Exp. Briefs 54<\/b> (2007) 277. DOI:10.1109\/TCSII.2006.888732","DOI":"10.1109\/TCSII.2006.888732"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] B. \u00c7atli and M. M. Hella: IEEE J. Solid-State Circuits 44<\/b> (2009) 2463. DOI:10.1109\/JSSC.2009.2023155","DOI":"10.1109\/JSSC.2009.2023155"},{"key":"4","doi-asserted-by":"crossref","unstructured":"[4] S.-L. Jang, C.-C. Shih, C.-C. Liu, C.-W. Chang and C.-W. Hsue: IEEE Microw. Wireless Compon. Lett. 21<\/b> (2011) 498. DOI:10.1109\/LMWC.2011.2162614","DOI":"10.1109\/LMWC.2011.2162614"},{"key":"5","doi-asserted-by":"crossref","unstructured":"[5] K.-H. Tsai and S.-I. Liu: IEEE Trans. Very Large Scale Integr. (VLSI) Syst. 20<\/b> (2012) 80. DOI:10.1109\/TVLSI.2010.2088144","DOI":"10.1109\/TVLSI.2010.2088144"},{"key":"6","doi-asserted-by":"crossref","unstructured":"[6] W. Zou, X. Chen, K. Dai and X. Zou: Electron. Lett. 48<\/b> (2012) 509. DOI:10.1049\/el.2012.0341","DOI":"10.1049\/el.2012.0341"},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] A. Italia, C. M. Ippolito and G. Palmisano: IEEE Trans. Circuits Syst. I, Reg. Papers 59<\/b> (2012) 1145. DOI:10.1109\/TCSI.2011.2173383","DOI":"10.1109\/TCSI.2011.2173383"},{"key":"8","doi-asserted-by":"crossref","unstructured":"[8] E. Ebrahimi and S. Naseh: IEEE Trans. Very Large Scale Integr. (VLSI) Syst. 21<\/b> (2013) 571. DOI:10.1109\/TVLSI.2012.2188310","DOI":"10.1109\/TVLSI.2012.2188310"},{"key":"9","doi-asserted-by":"crossref","unstructured":"[9] N.-J. Oh: IEICE Electron. Express 11<\/b> (2014) 20140432. DOI:10.1587\/elex.11.20140432","DOI":"10.1587\/elex.11.20140432"},{"key":"10","doi-asserted-by":"crossref","unstructured":"[10] S. S. Broussev, I. S. Uzunov and N. T. Tchamov: IEEE Trans. Circuits Syst. II, Exp. Briefs 59<\/b> (2012) 6. DOI:10.1109\/TCSII.2011.2177697","DOI":"10.1109\/TCSII.2011.2177697"},{"key":"11","doi-asserted-by":"crossref","unstructured":"[11] C. Samori, A. L. Lacaita, F. Villa and F. Zappa: IEEE Trans. Circuits Syst. II, Analog Digit. Signal Process. 45<\/b> (1998) 781. DOI:10.1109\/82.700925","DOI":"10.1109\/82.700925"},{"key":"12","doi-asserted-by":"crossref","unstructured":"[12] A. Hajimiri and T. H. Lee: IEEE J. Solid-State Circuits 34<\/b> (1999) 717. DOI:10.1109\/4.760384","DOI":"10.1109\/4.760384"},{"key":"13","doi-asserted-by":"crossref","unstructured":"[13] C. C. Boon, M. A. Do, K. S. Yeo, J. G. Ma and X. L. Zhang: IEEE Trans. Circuits Syst. II, Exp. Briefs 51<\/b> (2004) 85. DOI:10.1109\/TCSII.2003.821519","DOI":"10.1109\/TCSII.2003.821519"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/12\/8\/12_12.20150118\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T08:32:55Z","timestamp":1498206775000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/12\/8\/12_12.20150118\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015]]},"references-count":13,"journal-issue":{"issue":"8","published-print":{"date-parts":[[2015]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.12.20150118","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2015]]}}}