{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T02:21:11Z","timestamp":1706062871025},"reference-count":25,"publisher":"Association for Computing Machinery (ACM)","issue":"1","license":[{"start":{"date-parts":[[2017,8,1]],"date-time":"2017-08-01T00:00:00Z","timestamp":1501545600000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"crossref","award":["61672005 and 11331003"],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["ACM Trans. Des. Autom. Electron. Syst."],"published-print":{"date-parts":[[2018,1,31]]},"abstract":"\n Hybrid e-beam lithography (EBL) and triple patterning lithography (TPL) are advanced technologies for the manufacture of integrated circuits. We propose a technology that combines the advantages of EBL and TPL, which is more promising for the pattern product industry. Layout decomposition is a crucial step in this technology. In this article, we propose a two-stage decomposition flow for the hybrid e-beam and triple patterning lithography of the general layout decomposition (HETLD) problem. At the first stage, we formulate two optimization problems: the e-beam and stitch-aware TPL mask assignment (ESTMA) problem and the extended minimum weight dominating set for\n R<\/jats:italic>\n 4<\/jats:sub>\n mask assignment (MDS\n R<\/jats:italic>\n 4<\/jats:sub>\n MA) problem. Binary linear program formulations of the two problems are solved by the cutting plane approach. At the second stage, solutions of the first stage problems are legalized to feasible solutions of the HETLD problem by stitch insertion and e-beam shot. To speed up decomposition, we reduce the problem size by removing some vertices and some minor conflict edges before decomposition. Experimental results show the effectiveness of our decomposition methods based on ESTMA and MDS\n R<\/jats:italic>\n 4<\/jats:sub>\n MA.\n <\/jats:p>","DOI":"10.1145\/3084683","type":"journal-article","created":{"date-parts":[[2017,8,1]],"date-time":"2017-08-01T19:20:44Z","timestamp":1501615244000},"page":"1-23","update-policy":"http:\/\/dx.doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":5,"title":["Two-Stage Layout Decomposition for Hybrid E-Beam and Triple Patterning Lithography"],"prefix":"10.1145","volume":"23","author":[{"given":"Xingquan","family":"Li","sequence":"first","affiliation":[{"name":"Fuzhou University, China"}]},{"given":"Wenxing","family":"Zhu","sequence":"additional","affiliation":[{"name":"Fuzhou University, China"}]}],"member":"320","published-online":{"date-parts":[[2017,8]]},"reference":[{"key":"e_1_2_1_1_1","unstructured":"Yan Borodovsky. 2009. Lithography 2009 overview of opportunities. In Semicon West. Yan Borodovsky. 2009. Lithography 2009 overview of opportunities. In Semicon West."},{"key":"e_1_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/2744769.2747925"},{"key":"e_1_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1177\/104538901400438109"},{"key":"e_1_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2408253"},{"key":"e_1_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593233"},{"key":"e_1_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165047"},{"key":"e_1_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2013.2288678"},{"key":"e_1_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1117\/12.868483"},{"key":"e_1_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2014.6742880"},{"key":"e_1_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1016\/0304-3975(76)90059-1"},{"key":"e_1_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1117\/12.483702"},{"key":"e_1_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488818"},{"key":"e_1_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2016.2582154"},{"key":"e_1_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2013.2296496"},{"key":"e_1_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1117\/12.916315"},{"key":"e_1_2_1_16_1","volume-title":"Gurobi Optimizer Feference Manual, 2014","author":"Optimization Gurobi","year":"2014","unstructured":"Gurobi Optimization . 2014 . Inc ., Gurobi Optimizer Feference Manual, 2014 . Retrieved March 27, 2014 from www.gurobi.com. Gurobi Optimization. 2014. Inc., Gurobi Optimizer Feference Manual, 2014. Retrieved March 27, 2014 from www.gurobi.com."},{"key":"e_1_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1117\/12.600925"},{"key":"e_1_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001341"},{"key":"e_1_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1117\/12.2046499"},{"key":"e_1_2_1_20_1","volume-title":"Proceedings of the Semiconductor Industry Association","author":"Wilson Linda","year":"2013","unstructured":"Linda Wilson . 2013 . International technology roadmap for semiconductors (ITRS) . In Proceedings of the Semiconductor Industry Association (2013). Linda Wilson. 2013. International technology roadmap for semiconductors (ITRS). In Proceedings of the Semiconductor Industry Association (2013)."},{"key":"e_1_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2512903"},{"key":"e_1_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2401571"},{"key":"e_1_2_1_23_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2387840"},{"key":"e_1_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488819"},{"key":"e_1_2_1_25_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2179041"}],"container-title":["ACM Transactions on Design Automation of Electronic Systems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3084683","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,31]],"date-time":"2022-12-31T07:36:08Z","timestamp":1672472168000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3084683"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,8]]},"references-count":25,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2018,1,31]]}},"alternative-id":["10.1145\/3084683"],"URL":"https:\/\/doi.org\/10.1145\/3084683","relation":{},"ISSN":["1084-4309","1557-7309"],"issn-type":[{"value":"1084-4309","type":"print"},{"value":"1557-7309","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,8]]},"assertion":[{"value":"2016-09-01","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2017-04-01","order":1,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2017-08-01","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}