{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T00:39:04Z","timestamp":1725669544234},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,12]]},"DOI":"10.1109\/vlsitechnologyandcir46769.2022.9830411","type":"proceedings-article","created":{"date-parts":[[2022,7,22]],"date-time":"2022-07-22T16:42:52Z","timestamp":1658508172000},"page":"385-386","source":"Crossref","is-referenced-by-count":2,"title":["Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network"],"prefix":"10.1109","author":[{"given":"Kyosuke","family":"Kobinata","sequence":"first","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Kanagawa,Japan"}]},{"given":"Tatsuya","family":"Funaki","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Kanagawa,Japan"}]},{"given":"Yoshiaki","family":"Satake","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Kanagawa,Japan"}]},{"given":"Hitoshi","family":"Matsuno","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Kanagawa,Japan"}]},{"given":"Seiji","family":"Hidaka","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Kanagawa,Japan"}]},{"given":"Shunsuke","family":"Abe","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Kanagawa,Japan"}]},{"given":"Hiroyuki","family":"Ito","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Kanagawa,Japan"}]},{"given":"Chih-Cheng","family":"Hsiao","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute,Hsinchu,Taiwan"}]},{"given":"Sheng Yi","family":"Li","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute,Hsinchu,Taiwan"}]},{"given":"Youngsuk","family":"Kim","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Kanagawa,Japan"}]},{"given":"Takayuki","family":"Ohba","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Kanagawa,Japan"}]}],"member":"263","reference":[{"journal-title":"ECTC","first-page":"1300","year":"2021","author":"jatlaoui","key":"ref4"},{"journal-title":"ECTC","first-page":"861","year":"2020","author":"kim","key":"ref3"},{"journal-title":"VLSI","year":"2020","author":"chujo","key":"ref6"},{"journal-title":"ECTC","first-page":"1968","year":"2018","author":"kim","key":"ref5"},{"journal-title":"ECTC","first-page":"1152","year":"2018","author":"deprospo","key":"ref8"},{"journal-title":"ICEP","first-page":"17","year":"2021","author":"satake","key":"ref7"},{"journal-title":"ECTC","first-page":"185","year":"2021","author":"funaki","key":"ref2"},{"journal-title":"IEEE MTT-S IMS","first-page":"383","year":"0","author":"ito","key":"ref9"},{"journal-title":"SSDM","first-page":"119","year":"2020","author":"satake","key":"ref1"}],"event":{"name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","start":{"date-parts":[[2022,6,12]]},"location":"Honolulu, HI, USA","end":{"date-parts":[[2022,6,17]]}},"container-title":["2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9830116\/9830138\/09830411.pdf?arnumber=9830411","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,15]],"date-time":"2022-08-15T20:03:48Z","timestamp":1660593828000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9830411\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,12]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46769.2022.9830411","relation":{},"subject":[],"published":{"date-parts":[[2022,6,12]]}}}