乐胖代购免代理版

{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,4]],"date-time":"2025-04-04T07:47:39Z","timestamp":1743752859294,"version":"3.37.3"},"reference-count":54,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2020,6,1]],"date-time":"2020-06-01T00:00:00Z","timestamp":1590969600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,6,1]],"date-time":"2020-06-01T00:00:00Z","timestamp":1590969600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,6,1]],"date-time":"2020-06-01T00:00:00Z","timestamp":1590969600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["2017M3C4A7080243"],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["NRF-2018R1D1A3B07045908"],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100004358","name":"Samsung","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]},{"name":"College of Information, Korea University"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput."],"published-print":{"date-parts":[[2020,6,1]]},"DOI":"10.1109\/tc.2020.2970062","type":"journal-article","created":{"date-parts":[[2020,1,28]],"date-time":"2020-01-28T22:49:02Z","timestamp":1580251742000},"page":"894-906","source":"Crossref","is-referenced-by-count":27,"title":["An Adaptive Thermal Management Framework for Heterogeneous Multi-Core Processors"],"prefix":"10.1109","volume":"69","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4713-819X","authenticated-orcid":false,"given":"Young Geun","family":"Kim","sequence":"first","affiliation":[]},{"given":"Minyong","family":"Kim","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9013-9561","authenticated-orcid":false,"given":"Joonho","family":"Kong","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5347-9586","authenticated-orcid":false,"given":"Sung Woo","family":"Chung","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2010.5419681"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176542"},{"key":"ref33","doi-asserted-by":"crossref","first-page":"695","DOI":"10.1109\/TCAD.2012.2235126","article-title":"Accurate modeling of the delay and energy overhead of dynamic voltage and frequency scaling in modern microprocessors","volume":"32","author":"park","year":"2013","journal-title":"IEEE Trans Comput -Aided Des Integr Circuits Syst"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2375335"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.2307\/2324783"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488949"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/IISWC.2015.7"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1007\/s11227-014-1140-y"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/CASES.2013.6662519"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1145\/781027.781076"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2012.23"},{"key":"ref27","first-page":"1","article-title":"Event-driven thermal management in SMP systems","author":"merkel","year":"2005","journal-title":"Proc Int Workshop Temp -Aware Comput Syst"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2011.214"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/3126567"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2011.5993657"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/2187671.2187675"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.05.029"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2009.136"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488735"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2013.2261436"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2611501"},{"key":"ref25","first-page":"1","article-title":"A linux-governor based dynamic reliability management for android mobile devices","author":"mercati","year":"2014","journal-title":"Proc Des Autom Test Europe Conf"},{"year":"0","key":"ref50"},{"year":"0","key":"ref51"},{"year":"0","key":"ref54"},{"year":"0","key":"ref53"},{"year":"0","key":"ref52"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837417"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2011.156"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593239"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/2829946"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2006.8"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2012.24"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2009.5413115"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2016.2595560"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2013.188"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2015.0611"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2018.2822683"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2015.7372611"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2770163"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2009.5090885"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/1283780.1283826"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2015.7273508"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2012.6237019"},{"year":"0","key":"ref49"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VLSID.2017.35"},{"year":"0","key":"ref46"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691125"},{"year":"0","key":"ref48"},{"year":"0","key":"ref47"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1115\/InterPACK2009-89074"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1145\/2847255"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2017.2674302"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2896776"}],"container-title":["IEEE Transactions on Computers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/12\/9090228\/08972610.pdf?arnumber=8972610","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T14:19:53Z","timestamp":1651069193000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8972610\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,6,1]]},"references-count":54,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tc.2020.2970062","relation":{},"ISSN":["0018-9340","1557-9956","2326-3814"],"issn-type":[{"type":"print","value":"0018-9340"},{"type":"electronic","value":"1557-9956"},{"type":"electronic","value":"2326-3814"}],"subject":[],"published":{"date-parts":[[2020,6,1]]}}}