{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T04:02:19Z","timestamp":1725681739258},"reference-count":27,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,5]],"date-time":"2023-09-05T00:00:00Z","timestamp":1693872000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,5]],"date-time":"2023-09-05T00:00:00Z","timestamp":1693872000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,5]]},"DOI":"10.1109\/socc58585.2023.10256927","type":"proceedings-article","created":{"date-parts":[[2023,9,22]],"date-time":"2023-09-22T13:45:42Z","timestamp":1695390342000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Thermal Integrity of ReRAM-based Near-Memory Computing in 3D Integrated DNN Accelerators"],"prefix":"10.1109","author":[{"given":"Abrar","family":"Abdurrob","sequence":"first","affiliation":[{"name":"Stony Brook University (SUNY), Stony Brook,Department of Electrical and Computer Engineering,New York,11794"}]},{"given":"Emre","family":"Salman","sequence":"additional","affiliation":[{"name":"Stony Brook University (SUNY), Stony Brook,Department of Electrical and Computer Engineering,New York,11794"}]},{"given":"Jack","family":"Lombardi","sequence":"additional","affiliation":[{"name":"Air Force Research Laboratory,Rome,New York,13441"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2011.2160265"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1186\/s11671-020-03299-9"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3394885.3431577"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/IPDPS.2018.00076"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISDCS52006.2021.9397913"},{"key":"ref10","first-page":"1","article-title":"Thermal simulation of processing-in-memory devices using hotspot 7.0","author":"han","year":"2021","journal-title":"20th International Workshop on Thermal Investigations of ICs and Systems"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2749469.2750385"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/2.375174"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2023.3285039"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2017.54"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.15353\/vsnl.v3i1.171"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/3299874.3319485"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2017.8050790"},{"journal-title":"IEEE Transactions on COMPUTER-AIDED DESIGN of Integrated Circuits and Systems (TCAD)","article-title":"Pact: An extensible parallel thermal simulator for emerging integration and cooling technologies","year":"2021","author":"yuan","key":"ref26"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2768330"},{"article-title":"SCALE-Sim: Systolic CNN Accelerator Simulator","year":"2019","author":"samajdar","key":"ref20"},{"journal-title":"Embedded LPDDR2 SDRAM Features","year":"2014","key":"ref22"},{"article-title":"CACTI 6.5","year":"2009","author":"thoziyoor","key":"ref21"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/3417708"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICASSP.2014.6855225"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3051250"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIT.2017.7998149"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TC.1970.5008902"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2019.2934048"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/1394608.1382159"},{"journal-title":"Physical Design for 3D Integrated Circuits","year":"2016","author":"todri-sanial","key":"ref5"}],"event":{"name":"2023 IEEE 36th International System-on-Chip Conference (SOCC)","start":{"date-parts":[[2023,9,5]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2023,9,8]]}},"container-title":["2023 IEEE 36th International System-on-Chip Conference (SOCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10256666\/10256705\/10256927.pdf?arnumber=10256927","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,10,9]],"date-time":"2023-10-09T14:13:28Z","timestamp":1696860808000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10256927\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,5]]},"references-count":27,"URL":"https:\/\/doi.org\/10.1109\/socc58585.2023.10256927","relation":{},"subject":[],"published":{"date-parts":[[2023,9,5]]}}}