{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T21:43:36Z","timestamp":1725745416878},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,8,9]],"date-time":"2021-08-09T00:00:00Z","timestamp":1628467200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,8,9]],"date-time":"2021-08-09T00:00:00Z","timestamp":1628467200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,8,9]],"date-time":"2021-08-09T00:00:00Z","timestamp":1628467200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,8,9]]},"DOI":"10.1109\/mwscas47672.2021.9531736","type":"proceedings-article","created":{"date-parts":[[2021,9,13]],"date-time":"2021-09-13T18:17:52Z","timestamp":1631557072000},"page":"575-578","source":"Crossref","is-referenced-by-count":4,"title":["Bootstrapping Techniques for Energy-Efficient SAR ADCs : A State-of-the-Art Review"],"prefix":"10.1109","author":[{"given":"Fei","family":"Yuan","sequence":"first","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2002.808156"},{"journal-title":"Analog Integrated Circuit Design","year":"2012","author":"carusone","key":"ref11"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/NORCHIP.2014.7004703"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/NORCHIP.2010.5669444"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/4.760369"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/4.364429"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2007.899449"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2005.852927"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1049\/el.2014.3922"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2042254"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/4.75040"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2016.2573978"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2018.2833866"}],"event":{"name":"2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)","start":{"date-parts":[[2021,8,9]]},"location":"Lansing, MI, USA","end":{"date-parts":[[2021,8,11]]}},"container-title":["2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9531648\/9531647\/09531736.pdf?arnumber=9531736","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T11:45:43Z","timestamp":1652183143000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9531736\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,8,9]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/mwscas47672.2021.9531736","relation":{},"subject":[],"published":{"date-parts":[[2021,8,9]]}}}