{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T09:32:47Z","timestamp":1730280767707,"version":"3.28.0"},"reference-count":28,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004562","name":"French Ministry of Higher Education","doi-asserted-by":"publisher","award":["ANR-11-IDFI-0017"],"id":[{"id":"10.13039\/501100004562","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,3,1]]},"DOI":"10.1109\/lascas53948.2022.9789087","type":"proceedings-article","created":{"date-parts":[[2022,6,8]],"date-time":"2022-06-08T15:43:58Z","timestamp":1654703038000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Technical and pedagogical challenges in micro-nanoelectronics for facing upcoming digital society"],"prefix":"10.1109","author":[{"given":"Olivier","family":"Bonnaud","sequence":"first","affiliation":[{"name":"Insitut d'Electronique et des Technologies du numéRique, University of Rennes 1,Rennes,France"}]}],"member":"263","reference":[{"journal-title":"Cerebras's silicon-wafer-size chip boasts 2 6 trillion transistors","year":"0","author":"moore","key":"ref10"},{"key":"ref11","article-title":"Is the internet on the brink of collapse? The web could reach its limit in just eight years and use all of Britain's power supply by 2035","volume":"3","author":"spencer","year":"2015","journal-title":"Warn Scientists Daily Mail"},{"year":"0","key":"ref12"},{"key":"ref13","first-page":"106","article-title":"Innovative Strategy to Meet the Challenges of the Future Digital Society O. Bonnaud","volume":"6","author":"bonnaud","year":"2021","journal-title":"Advances in Technology Innovation"},{"key":"ref14","first-page":"1","article-title":"The technological challenges of microelectronics for the next generations of connected sensors","volume":"14","author":"bonnaud","year":"2020","journal-title":"Int J Plasma Environ Sci Technol"},{"journal-title":"Alliance Electronique (French electronics industry union)","year":"0","key":"ref15"},{"journal-title":"GIP-CNFM “Coordination Nationale pour la formation en Microelectronique and nanotechnologies”","year":"0","key":"ref16"},{"key":"ref17","first-page":"415","article-title":"Industry 4.0: An Overview","volume":"2236","author":"santos","year":"2018","journal-title":"Proceedings of the World Congress on Engineering"},{"journal-title":"National Recovery and Resilience Plan for France","year":"0","key":"ref18"},{"key":"ref19","first-page":"168","article-title":"National recovery plan for the electronics industryin France; importance of training in the field","author":"bonnaud","year":"2021","journal-title":"30th Annual Conference of the European Association for Education in Electrical and Information Engineering (EAEEIE)"},{"journal-title":"EDACafè Blog","article-title":"Scaling challenges and the increasing importance of design-technology co-optimization","year":"2021","author":"frazzoli","key":"ref28"},{"journal-title":"Filière Industries de l'electronique","year":"0","key":"ref4"},{"key":"ref27","first-page":"115","article-title":"New Approach for Sensors and Connecting Objects Involving Microelectronic Multidisciplinarity for a Wide Spectrum of Applications","volume":"10","author":"bonnaud","year":"2016","journal-title":"International Journal of Plasma Environmental Science and Technology"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.5194\/jsss-7-359-2018"},{"key":"ref6","article-title":"How much data is generated each day?","volume":"17","author":"desjardins","year":"2019","journal-title":"World Economic Forum"},{"journal-title":"CSF - Comité Stratégique de filière “Industrie Electronique”","year":"0","key":"ref5"},{"journal-title":"International Energy Agency","year":"0","key":"ref8"},{"journal-title":"2020 Forecast Highlights","year":"0","key":"ref7"},{"journal-title":"System-On-Package Miniaturization of the Entire System","year":"2008","author":"tummala","key":"ref2"},{"journal-title":"Volume of data\/information created captured copied and consumed worldwide from 2010 to 2025","year":"0","key":"ref9"},{"key":"ref1","first-page":"114","article-title":"Cramming more components onto integrated circuits","volume":"38","author":"moore","year":"1965","journal-title":"Electronics Magazine"},{"journal-title":"Recovery plan for Europe","year":"0","key":"ref20"},{"key":"ref22","first-page":"8","article-title":"Know-how needs for higher education in nanoelectronics: French CNFM network strategy, ICnan0201810-12 October 2018","volume":"3","author":"bonnaud","year":"2018","journal-title":"Advanced Materials Proceedings"},{"key":"ref21","first-page":"122","article-title":"GIP-CNFM: a French education network moving from microelectronics to nanotechnologies","author":"bonnaud","year":"2011","journal-title":"Proceedings of EDUCON'11 Amman"},{"key":"ref24","doi-asserted-by":"crossref","first-page":"31","DOI":"10.1007\/978-981-15-5584-8_3","article-title":"FINMINA “Formation INnovante en MIcro et NAuioélectronique”: a French national project dedicated to educational innovation in microelectronics to meet the challenges of a digital society, Smart Education and e-learning 2020","author":"bonnaud","year":"2020","journal-title":"Smart Innovation Systems and Technologies 188"},{"key":"ref23","first-page":"1","article-title":"Innovation for education on Internet of things, International Conference on Advanced Technology Innovation (ICATI'2018)","volume":"9","author":"bonnaud","year":"0","journal-title":"Proc of Engineering and Technology Innovation PETI"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1007\/s12599-015-0383-3"},{"journal-title":"Important Projects of Common European Interest","year":"0","key":"ref25"}],"event":{"name":"2022 IEEE 13th Latin America Symposium on Circuits and System (LASCAS)","start":{"date-parts":[[2022,3,1]]},"location":"Puerto Varas, Chile","end":{"date-parts":[[2022,3,4]]}},"container-title":["2022 IEEE 13th Latin America Symposium on Circuits and System (LASCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9789038\/9789039\/09789087.pdf?arnumber=9789087","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,11]],"date-time":"2022-07-11T16:03:38Z","timestamp":1657555418000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9789087\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,3,1]]},"references-count":28,"URL":"https:\/\/doi.org\/10.1109\/lascas53948.2022.9789087","relation":{},"subject":[],"published":{"date-parts":[[2022,3,1]]}}}