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{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,27]],"date-time":"2024-09-27T04:16:20Z","timestamp":1727410580785},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2024,10,1]],"date-time":"2024-10-01T00:00:00Z","timestamp":1727740800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,10,1]],"date-time":"2024-10-01T00:00:00Z","timestamp":1727740800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,1]],"date-time":"2024-10-01T00:00:00Z","timestamp":1727740800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100004359","name":"Sony Semiconductor Solutions Corporation\/Sony Electronics Inc","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004359","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,10]]},"DOI":"10.1109\/jssc.2024.3410306","type":"journal-article","created":{"date-parts":[[2024,6,20]],"date-time":"2024-06-20T17:34:36Z","timestamp":1718904876000},"page":"3488-3501","source":"Crossref","is-referenced-by-count":0,"title":["AIMMI: Audio and Image Multi-Modal Intelligence via a Low-Power SoC With 2-MByte On-Chip MRAM for IoT Devices"],"prefix":"10.1109","volume":"59","author":[{"ORCID":"http:\/\/orcid.org\/0000-0002-8181-2996","authenticated-orcid":false,"given":"Zichen","family":"Fan","sequence":"first","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0001-8113-3558","authenticated-orcid":false,"given":"Qirui","family":"Zhang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-6322-025X","authenticated-orcid":false,"given":"Hyochan","family":"An","sequence":"additional","affiliation":[{"name":"Apple, Inc., Cupertino, CA, USA"}]},{"given":"Boxun","family":"Xu","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0001-5968-5751","authenticated-orcid":false,"given":"Li","family":"Xu","sequence":"additional","affiliation":[{"name":"NVIDIA Corporation, Santa Clara, CA, USA"}]},{"ORCID":"http:\/\/orcid.org\/0009-0007-4280-2676","authenticated-orcid":false,"given":"Chien-Wei","family":"Tseng","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0001-9860-0175","authenticated-orcid":false,"given":"Yimai","family":"Peng","sequence":"additional","affiliation":[{"name":"Qualcomm, Inc., Raleigh, NC, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-7269-4545","authenticated-orcid":false,"given":"Andrea","family":"Bejarano-Carbo","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0001-9523-6152","authenticated-orcid":false,"given":"Pierre","family":"Abillama","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]},{"given":"Ang","family":"Cao","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-4194-8119","authenticated-orcid":false,"given":"Bowen","family":"Liu","sequence":"additional","affiliation":[{"name":"Zoom, Inc., San Jose, CA, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-5610-0671","authenticated-orcid":false,"given":"Changwoo","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0001-5112-639X","authenticated-orcid":false,"given":"Zhehong","family":"Wang","sequence":"additional","affiliation":[{"name":"Meta Platforms, Inc., Menlo Park, CA, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-6658-5502","authenticated-orcid":false,"given":"Hun-Seok","family":"Kim","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0001-6744-7075","authenticated-orcid":false,"given":"David","family":"Blaauw","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]},{"ORCID":"http:\/\/orcid.org\/0000-0003-2598-0458","authenticated-orcid":false,"given":"Dennis","family":"Sylvester","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI, USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3041858"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/VLSICircuits18222.2020.9162810"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492401"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2968800"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2020.3014454"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3360307"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/3579371.3589350"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2939664"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2936756"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3059649"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3090668"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3034192"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731675"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.3390\/s20113101"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2018.8502309"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ICASSP40776.2020.9053233"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-01261-8_5"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-58523-5_13"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.90"},{"key":"ref21","article-title":"MobileNets: Efficient convolutional neural networks for mobile vision applications","author":"Howard","year":"2017","journal-title":"arXiv:1704.04861"},{"key":"ref22","article-title":"Deep compression: Compressing deep neural networks with pruning, trained quantization and Huffman coding","author":"Han","year":"2015","journal-title":"arXiv:1510.00149"},{"key":"ref23","article-title":"Discovering low-precision networks close to full-precision networks for efficient embedded inference","author":"McKinstry","year":"2018","journal-title":"arXiv:1809.04191"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.2965403"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062955"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3114881"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3236566"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830226"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830340"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2930910"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067339"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2019.8715103"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3066572"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-10602-1_48"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.35111\/17gk-bn40"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.21437\/Interspeech.2017-950"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3140753"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/10693678\/10565979.pdf?arnumber=10565979","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,26]],"date-time":"2024-09-26T06:06:54Z","timestamp":1727330814000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10565979\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10]]},"references-count":37,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2024.3410306","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"type":"print","value":"0018-9200"},{"type":"electronic","value":"1558-173X"}],"subject":[],"published":{"date-parts":[[2024,10]]}}}