乐胖代购免代理版

{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,9]],"date-time":"2025-04-09T21:03:40Z","timestamp":1744232620634,"version":"3.37.3"},"reference-count":40,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004368","name":"Taiwan Semiconductor Manufacturing Company (TSMC)-Joint Developed Project","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100004368","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Science and Technology Council (NSTC) of Taiwan"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,1]]},"DOI":"10.1109\/jssc.2023.3324335","type":"journal-article","created":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T17:55:39Z","timestamp":1698170139000},"page":"219-230","source":"Crossref","is-referenced-by-count":5,"title":["An 8b-Precision 8-Mb STT-MRAM Near-Memory-Compute Macro Using Weight-Feature and Input-Sparsity Aware Schemes for Energy-Efficient Edge AI Devices"],"prefix":"10.1109","volume":"59","author":[{"ORCID":"https:\/\/orcid.org\/0009-0003-0588-9953","authenticated-orcid":false,"given":"De-Qi","family":"You","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Yen-Cheng","family":"Chiu","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Win-San","family":"Khwa","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan"}]},{"given":"Chung-Yuan","family":"Li","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Fang-Ling","family":"Hsieh","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Yu-An","family":"Chien","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Chung-Chuan","family":"Lo","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5311-4955","authenticated-orcid":false,"given":"Ren-Shuo","family":"Liu","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4070-5059","authenticated-orcid":false,"given":"Chi-Cheng","family":"Hsieh","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9689-1236","authenticated-orcid":false,"given":"Kea-Tiong","family":"Tang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Yu-Der","family":"Chih","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan"}]},{"given":"Tsung-Yung Jonathan","family":"Chang","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6905-6350","authenticated-orcid":false,"given":"Meng-Fan","family":"Chang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3064189"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/OJSSCS.2021.3123287"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731754"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731545"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365766"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062985"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2899730"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662392"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310397"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-021-04196-6"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-022-04992-8"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731725"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731670"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731715"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-020-00505-5"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365926"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365769"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-020-1942-4"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9063078"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062953"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-019-0270-x"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-019-0288-0"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-018-0180-5"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662395"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-017-0002-z"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0023-2"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310400"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2018.8510676"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2016.2526647"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067563"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731621"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062955"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310393"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870428"},{"key":"ref35","first-page":"27.2.1","article-title":"Highly functional and reliable 8Mb STT-MRAM embedded in 28 nm logic","volume-title":"IEDM Tech. Dig.","author":"Song"},{"key":"ref36","first-page":"1","article-title":"45 nm low power CMOS logic compatible embedded STT MRAM utilizing a reverse-connection 1T\/1MTJ cell","volume-title":"IEDM Tech. Dig.","author":"Lin"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.829399"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.90"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3112182"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3199077"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10375801\/10292992.pdf?arnumber=10292992","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,8]],"date-time":"2025-01-08T20:12:29Z","timestamp":1736367149000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10292992\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,1]]},"references-count":40,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2023.3324335","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"type":"print","value":"0018-9200"},{"type":"electronic","value":"1558-173X"}],"subject":[],"published":{"date-parts":[[2024,1]]}}}