{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T07:44:41Z","timestamp":1725781481075},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,2]]},"DOI":"10.1109\/isscc.2015.7063103","type":"proceedings-article","created":{"date-parts":[[2015,3,20]],"date-time":"2015-03-20T17:20:29Z","timestamp":1426872029000},"page":"1-3","source":"Crossref","is-referenced-by-count":19,"title":["22.9 A 1310nm 3D-integrated silicon photonics Mach-Zehnder-based transmitter with 275mW multistage CMOS driver achieving 6dB extinction ratio at 25Gb\/s"],"prefix":"10.1109","author":[{"given":"Marco","family":"Cignoli","sequence":"first","affiliation":[]},{"given":"Gabriele","family":"Minoia","sequence":"additional","affiliation":[]},{"given":"Matteo","family":"Repossi","sequence":"additional","affiliation":[]},{"given":"Daniele","family":"Baldi","sequence":"additional","affiliation":[]},{"given":"Andrea","family":"Ghilioni","sequence":"additional","affiliation":[]},{"given":"Enrico","family":"Temporiti","sequence":"additional","affiliation":[]},{"given":"Francesco","family":"Svelto","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"13.3.1","article-title":"A rnulti-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb\/s applications","author":"boeuf","year":"2013","journal-title":"IEEE Int Dev Meeting (IEDM)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1038\/nphoton.2010.179"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/GROUP4.2007.4347710"},{"key":"ref5","first-page":"1","article-title":"Monolithically integrated 10Gbit\/sec Silicon modulator with driver in 0.25?m SiGe:C BiCMOS","author":"zimmermann","year":"2013","journal-title":"Eur Conf Optical Communication (ECOC)"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1002\/0471726400"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2012.6146487"}],"event":{"name":"2015 IEEE International Solid- State Circuits Conference - (ISSCC)","start":{"date-parts":[[2015,2,22]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2015,2,26]]}},"container-title":["2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7054075\/7062838\/07063103.pdf?arnumber=7063103","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T23:31:15Z","timestamp":1490311875000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7063103\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,2]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc.2015.7063103","relation":{},"subject":[],"published":{"date-parts":[[2015,2]]}}}