{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T11:08:11Z","timestamp":1725707291528},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,10,20]],"date-time":"2020-10-20T00:00:00Z","timestamp":1603152000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,10,20]],"date-time":"2020-10-20T00:00:00Z","timestamp":1603152000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,10,20]],"date-time":"2020-10-20T00:00:00Z","timestamp":1603152000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,10,20]]},"DOI":"10.1109\/isncc49221.2020.9297313","type":"proceedings-article","created":{"date-parts":[[2020,12,25]],"date-time":"2020-12-25T17:06:21Z","timestamp":1608915981000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["A Thermal Aware Approach to Enhance 5G Device Performance and Reliability in mmWave Networks"],"prefix":"10.1109","author":[{"given":"Anurag","family":"Thantharate","sequence":"first","affiliation":[]},{"given":"Cory","family":"Beard","sequence":"additional","affiliation":[]},{"given":"Sreekar","family":"Marupaduga","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2299397"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2013.2260813"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/GLOCOM.2018.8648031"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCNC.2019.8685530"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VTCSpring.2016.7504476"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/UEMCON47517.2019.8993066"},{"journal-title":"Dataset 5G mmWave Throughput data in different RF condition and Thermal Measurement","year":"0","key":"ref12"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2014.6736745"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/VETECS.2011.5956528"},{"journal-title":"Ericsson Mobility Report","year":"0","key":"ref2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/UEMCON47517.2019.8993067"},{"year":"0","key":"ref1"}],"event":{"name":"2020 International Symposium on Networks, Computers and Communications (ISNCC)","start":{"date-parts":[[2020,10,20]]},"location":"Montreal, QC, Canada","end":{"date-parts":[[2020,10,22]]}},"container-title":["2020 International Symposium on Networks, Computers and Communications (ISNCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9297148\/9297168\/09297313.pdf?arnumber=9297313","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,28]],"date-time":"2022-06-28T17:55:03Z","timestamp":1656438903000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9297313\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,10,20]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/isncc49221.2020.9297313","relation":{},"subject":[],"published":{"date-parts":[[2020,10,20]]}}}