{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T15:25:43Z","timestamp":1725549943229},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,12]]},"DOI":"10.1109\/icecs.2014.7050051","type":"proceedings-article","created":{"date-parts":[[2015,3,3]],"date-time":"2015-03-03T15:03:03Z","timestamp":1425394983000},"page":"578-581","source":"Crossref","is-referenced-by-count":4,"title":["3D floorplanning with nets-to-TSVs assignment"],"prefix":"10.1109","author":[{"given":"M. A.","family":"Ahmed","sequence":"first","affiliation":[]},{"given":"S.","family":"Mohapatra","sequence":"additional","affiliation":[]},{"given":"M.","family":"Chrzanowska-Jeske","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2190537"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2050012"},{"year":"0","key":"ref10"},{"key":"ref6","first-page":"590","article-title":"3-D-STAF: Scalabletemperature and leakage aware floorplanning for 3-D integrated circuits","author":"zhou","year":"2007","journal-title":"Proc IEEE Int Canf Comput -Aided Design"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101910"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LASCAS.2014.6820323"},{"key":"ref7","first-page":"838","article-title":"Factors Affecting Copper Filling Process Within High Aspect ratio Deep Vias for 3D Chip Stacking","author":"kim","year":"2007","journal-title":"Proc 57th Electron Compon Technol Conf Reno NV"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2174640"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2014.6783324"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2055247"}],"event":{"name":"2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)","start":{"date-parts":[[2014,12,7]]},"location":"Marseille, France","end":{"date-parts":[[2014,12,10]]}},"container-title":["2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7041007\/7049902\/07050051.pdf?arnumber=7050051","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T15:15:05Z","timestamp":1490368505000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7050051\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,12]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/icecs.2014.7050051","relation":{},"subject":[],"published":{"date-parts":[[2014,12]]}}}