{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T22:05:48Z","timestamp":1725746748017},"reference-count":0,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,8]]},"DOI":"10.1109\/hotchips.2011.7477497","type":"proceedings-article","created":{"date-parts":[[2016,7,7]],"date-time":"2016-07-07T21:31:09Z","timestamp":1467927069000},"page":"1-25","source":"Crossref","is-referenced-by-count":4,"title":["The world's fastest DSP core: Breaking the 100 GMAC\/s barrier"],"prefix":"10.1109","author":[{"given":"Chris","family":"Rowen","sequence":"first","affiliation":[]},{"given":"Dan","family":"Nicolaescu","sequence":"additional","affiliation":[]},{"given":"Rajiv","family":"Ravindran","sequence":"additional","affiliation":[]},{"given":"David","family":"Heine","sequence":"additional","affiliation":[]},{"given":"Grant","family":"Martin","sequence":"additional","affiliation":[]},{"given":"James","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Dror","family":"Maydan","sequence":"additional","affiliation":[]},{"given":"Nupur","family":"Andrews","sequence":"additional","affiliation":[]},{"given":"Bill","family":"Huffman","sequence":"additional","affiliation":[]},{"given":"Vakis","family":"Papaparaskeva","sequence":"additional","affiliation":[]},{"given":"Shay","family":"Gal-On","sequence":"additional","affiliation":[]},{"given":"Peter","family":"Nuth","sequence":"additional","affiliation":[]},{"given":"Pushkar","family":"Patwardhan","sequence":"additional","affiliation":[]},{"given":"Manish","family":"Paradkar","sequence":"additional","affiliation":[]}],"member":"263","event":{"name":"2011 IEEE Hot Chips 23 Symposium (HCS)","start":{"date-parts":[[2011,8,17]]},"location":"Stanford, CA, USA","end":{"date-parts":[[2011,8,19]]}},"container-title":["2011 IEEE Hot Chips 23 Symposium (HCS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7470410\/7477479\/07477497.pdf?arnumber=7477497","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,17]],"date-time":"2017-03-17T21:04:55Z","timestamp":1489784695000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7477497\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,8]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/hotchips.2011.7477497","relation":{},"subject":[],"published":{"date-parts":[[2011,8]]}}}