{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,4,16]],"date-time":"2024-04-16T05:52:45Z","timestamp":1713246765263},"reference-count":35,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2019,1,1]],"date-time":"2019-01-01T00:00:00Z","timestamp":1546300800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100005047","name":"Natural Science Foundation of Liaoning Province","doi-asserted-by":"publisher","award":["20170540791"],"id":[{"id":"10.13039\/501100005047","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2019]]},"DOI":"10.1109\/access.2019.2949386","type":"journal-article","created":{"date-parts":[[2019,10,24]],"date-time":"2019-10-24T19:54:55Z","timestamp":1571946895000},"page":"156121-156128","source":"Crossref","is-referenced-by-count":8,"title":["Analysis of the Effect of UV-LIGA Fabrication Error on the Microspring Elastic Coefficient"],"prefix":"10.1109","volume":"7","author":[{"ORCID":"http:\/\/orcid.org\/0000-0002-4195-1668","authenticated-orcid":false,"given":"Yu","family":"Qin","sequence":"first","affiliation":[]},{"given":"Liangyu","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Yongping","family":"Hao","sequence":"additional","affiliation":[]},{"given":"Shuangjie","family":"Liu","sequence":"additional","affiliation":[]},{"given":"Xianlong","family":"Hu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"crossref","first-page":"342","DOI":"10.1016\/S0924-4247(00)00408-8","article-title":"UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole","volume":"84","author":"chang","year":"2017","journal-title":"Sens Actuators A Phys"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/14\/11\/017"},{"key":"ref31","doi-asserted-by":"crossref","first-page":"2006","DOI":"10.3788\/OPE.20122009.2006","article-title":"Effect of ultrasonic treatment on SU-8 swelling in UV-LIGA technology","volume":"20","author":"du","year":"2012","journal-title":"Opt Precis Eng"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-001-0138-6"},{"key":"ref35","article-title":"A study on the elastic coefficients of setback micro-springs for a MEMS safety and arming device","author":"qin","year":"0","journal-title":"Microsyst Technol"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-017-0476-x"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.11591\/telkomnika.v10i6.1427"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-015-2758-2"},{"key":"ref12","first-page":"586","article-title":"Finite element dynamics analysis of micro-spring in MEMS inertia switch","volume":"30","author":"yang","year":"2008","journal-title":"J Mechan Streng"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(01)00623-9"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2008.03.025"},{"key":"ref15","first-page":"19","article-title":"Fabrication and characterization of S-form MEMS planer micro-springs","volume":"1","author":"shi","year":"2004","journal-title":"Tech Proc"},{"key":"ref16","article-title":"Contrastive study on the mechanical performance of MEMS microsprings fabricated by LIGA and UV-LIGA technology","volume":"3","author":"li","year":"2008","journal-title":"Proc SPIE"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-008-0758-1"},{"key":"ref18","first-page":"735","article-title":"Analysis of effect of MEMS fabrication error on the microspring mechanical property","volume":"31","author":"li","year":"2009","journal-title":"Pie & Acous"},{"key":"ref19","first-page":"80","article-title":"Analysis of dimension tolerance for MEMS Ni planar micro spring","volume":"29","author":"shao","year":"2012","journal-title":"J Mach"},{"key":"ref28","doi-asserted-by":"crossref","first-page":"308","DOI":"10.1007\/s00542-002-0176-8","article-title":"Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air gap elimination","volume":"8","author":"chuang","year":"2002","journal-title":"Microsyst Technol"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2018.8589799"},{"key":"ref27","first-page":"36","article-title":"Process optimization of optical lithography of SU-8 photoresist","volume":"5","author":"zhang","year":"2005","journal-title":"Micro Tech"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"77519","DOI":"10.1109\/ACCESS.2018.2883353","article-title":"Fabrication and characterization of capacitive RF MEMS perforated switch","volume":"6","author":"rao","year":"2018","journal-title":"IEEE Access"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1049\/mnl.2016.0662"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2003.10.006"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2909973"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1049\/mnl.2014.0398"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1049\/mnl.2018.0181"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2010.03.017"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1049\/mnl.2017.0463"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2920095"},{"key":"ref20","first-page":"110","article-title":"Analysis of fabracation error on MEMS Om-nidirectional trigger","volume":"37","author":"deng","year":"2016","journal-title":"Journal of Ordnance Equipment Engineering"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-014-2323-4"},{"key":"ref21","first-page":"380","article-title":"UV-LIGA: A promising and low-cost variant for microsystem technology","author":"qu","year":"1998","journal-title":"Proc Conf Optoelectron Microelectron Mater Devices"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/15\/11\/029"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2002.803279"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1117\/12.388266"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-005-0604-7"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8600701\/08882233.pdf?arnumber=8882233","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T02:08:51Z","timestamp":1643162931000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8882233\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019]]},"references-count":35,"URL":"https:\/\/doi.org\/10.1109\/access.2019.2949386","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019]]}}}