{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,7,9]],"date-time":"2024-07-09T10:30:58Z","timestamp":1720521058343},"reference-count":39,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2017,12,1]],"date-time":"2017-12-01T00:00:00Z","timestamp":1512086400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"funder":[{"DOI":"10.13039\/501100003549","name":"OTKA","doi-asserted-by":"publisher","award":["109232"],"id":[{"id":"10.13039\/501100003549","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2017,12]]},"DOI":"10.1016\/j.microrel.2017.05.028","type":"journal-article","created":{"date-parts":[[2017,6,7]],"date-time":"2017-06-07T14:45:57Z","timestamp":1496846757000},"page":"480-487","update-policy":"http:\/\/dx.doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":7,"special_numbering":"C","title":["Fabrication and characterization of microscale heat sinks"],"prefix":"10.1016","volume":"79","author":[{"given":"G\u00e1bor","family":"Tak\u00e1cs","sequence":"first","affiliation":[]},{"given":"Gy\u00f6rgy","family":"Bogn\u00e1r","sequence":"additional","affiliation":[]},{"given":"Enik\u0151","family":"B\u00e1ndy","sequence":"additional","affiliation":[]},{"given":"G\u00e1bor","family":"R\u00f3zs\u00e1s","sequence":"additional","affiliation":[]},{"given":"P\u00e9ter G.","family":"Szab\u00f3","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/j.microrel.2017.05.028_bb0005","series-title":"Heat Transfer: A Practical Approach","author":"\u00c7engel","year":"2003"},{"key":"10.1016\/j.microrel.2017.05.028_bb0010","series-title":"Proceedings of the 20th SEMI-THERM Symposium (SEMI-THERM'03)","first-page":"74","article-title":"Air-cooling extension \u2013 performance limits for processor cooling applications","author":"Sauciuc","year":"2003"},{"key":"10.1016\/j.microrel.2017.05.028_bb0015","series-title":"Proceedings of the 20th SEMI-THERM Symposium (SEMI-THERM'06)","first-page":"55","article-title":"Development of a high performance heat sink based on screen-fin technology","author":"Chen","year":"2003"},{"issue":"11","key":"10.1016\/j.microrel.2017.05.028_bb0020","doi-asserted-by":"crossref","first-page":"1165","DOI":"10.1016\/j.mejo.2005.07.017","article-title":"Advances in mesoscale thermal management technologies for microelectronics","volume":"37","author":"Garimella","year":"2006","journal-title":"Microelectron. J."},{"key":"10.1016\/j.microrel.2017.05.028_bb0025","series-title":"Proceedings of the 22nd SEMI-THERM Symposium (SEMI-THERM'06)","first-page":"135","article-title":"Hot spot cooling using embedded thermoelectric coolers","author":"Jeffrey Snyder","year":"2006"},{"key":"10.1016\/j.microrel.2017.05.028_bb0030","series-title":"Encyclopedia of Thermal Packaging: Set 1: Thermal Packaging Techniques","volume":"vol. 1","author":"Garimella","year":"2013"},{"key":"10.1016\/j.microrel.2017.05.028_bb0035","series-title":"Advanced Technology Workshop on Thermal Management, IMAPS ATW Conf","article-title":"Efficient liquid cooling technologies for computer systems","author":"Prechtl","year":"2004"},{"key":"10.1016\/j.microrel.2017.05.028_bb0040","series-title":"Proceedings of Computer-Aided Design (ICCAD)","first-page":"463","article-title":"3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling","author":"Arvind","year":"2010"},{"key":"10.1016\/j.microrel.2017.05.028_bb0045","series-title":"Proceedings of the 14th Biennial Baltic Electronics Conference (BEC2014)","first-page":"29","article-title":"Enhanced semitransparent monocrystalline silicon solar cell structure","author":"B\u00e1ndy","year":"2014"},{"issue":"12","key":"10.1016\/j.microrel.2017.05.028_bb0050","doi-asserted-by":"crossref","first-page":"1740","DOI":"10.1016\/j.mejo.2014.07.009","article-title":"Improved thermal characterization method of integrated microscale heat sinks","volume":"45","author":"Tak\u00e1cs","year":"2014","journal-title":"Microelectron. J."},{"key":"10.1016\/j.microrel.2017.05.028_bb0055","first-page":"1","article-title":"Modelling of the flow-rate dependent partial thermal resistance of integrated microscale cooling structures","author":"Tak\u00e1cs","year":"2016","journal-title":"Microsyst. Technol."},{"key":"10.1016\/j.microrel.2017.05.028_bb0060","series-title":"In: Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS\/MOEMS (DTIP'17)","first-page":"158","article-title":"Integrated microscale cooling for concentrator solar cells","author":"Plesz","year":"2017"},{"issue":"7","key":"10.1016\/j.microrel.2017.05.028_bb0065","doi-asserted-by":"crossref","first-page":"631","DOI":"10.1016\/j.ijthermalsci.2004.01.003","article-title":"Single-phase convective heat transfer in microchannels: a review of experimental results","volume":"43","author":"Morini","year":"2004","journal-title":"Int. J. Therm. Sci."},{"issue":"5","key":"10.1016\/j.microrel.2017.05.028_bb0070","doi-asserted-by":"crossref","first-page":"521","DOI":"10.1016\/j.mejo.2013.08.016","article-title":"Temperature dependent timing in standard cell designs","volume":"45","author":"Tim\u00e1r","year":"2014","journal-title":"Microelectron. J."},{"key":"10.1016\/j.microrel.2017.05.028_bb0075","series-title":"Proceedings of the 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013)","first-page":"376","article-title":"Logi-thermal simulation using accurate temperature dependent delay models","author":"Tim\u00e1r","year":"2013"},{"key":"10.1016\/j.microrel.2017.05.028_bb0080","series-title":"Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2014)","first-page":"1","article-title":"Advancing the thermal stability of 3D-IC's using logi-thermal simulation","author":"Nagy","year":"2014"},{"issue":"11","key":"10.1016\/j.microrel.2017.05.028_bb0085","doi-asserted-by":"crossref","first-page":"970","DOI":"10.1016\/j.mejo.2012.07.007","article-title":"Modelling and characterization of thermally induced skew on clock distribution networks of nanometric ICs","volume":"44","author":"Sassone","year":"2013","journal-title":"Microelectron. J."},{"issue":"5","key":"10.1016\/j.microrel.2017.05.028_bb0090","doi-asserted-by":"crossref","first-page":"665","DOI":"10.1109\/5.929649","article-title":"Clock distribution networks in synchronous digital integrated circuits","volume":"89","author":"Friedman","year":"2001","journal-title":"Proc. IEEE"},{"key":"10.1016\/j.microrel.2017.05.028_bb0095","series-title":"Proceedings of the 21st International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2015)","first-page":"1","article-title":"Enhanced thermal characterization method of microscale heatsink structures","author":"Tak\u00e1cs","year":"2015"},{"issue":"9","key":"10.1016\/j.microrel.2017.05.028_bb0100","doi-asserted-by":"crossref","first-page":"1363","DOI":"10.1016\/0038-1101(88)90099-8","article-title":"Fine structure of heat flow path in semiconductor devices: a measurement and identification method","volume":"31","author":"Sz\u00e9kely","year":"1988","journal-title":"Solid State Electron."},{"key":"10.1016\/j.microrel.2017.05.028_bb0105","series-title":"Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)","author":"JEDEC standard JESD51 1\u201314","year":"2005"},{"key":"10.1016\/j.microrel.2017.05.028_bb0110","series-title":"Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS\/MOEMS (DTIP'16)","first-page":"173","article-title":"Thermal modelling of integrated heatsink structures","author":"Bogn\u00e1r","year":"2016"},{"key":"10.1016\/j.microrel.2017.05.028_bb0115","series-title":"Proceedings of the 22nd International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2016)","first-page":"264","article-title":"Fabrication and characterization of microscale heat sinks","author":"Takacs","year":"2016"},{"key":"10.1016\/j.microrel.2017.05.028_bb0120","unstructured":"PhoeniX Software, CleWin 5, http:\/\/www.phoenixbv.com\/flyers\/CleWin5.pdf"},{"issue":"15","key":"10.1016\/j.microrel.2017.05.028_bb0125","doi-asserted-by":"crossref","first-page":"2319","DOI":"10.1016\/j.solmat.2006.03.005","article-title":"Pyramidal texturing of silicon solar cell with TMAH chemical anisotropic etching","volume":"90","author":"Papet","year":"2006","journal-title":"Sol. Energy Mater. Sol. Cells"},{"key":"10.1016\/j.microrel.2017.05.028_bb0130","series-title":"Micromachined Instrumentation Systems","author":"Klaassen","year":"1996"},{"issue":"1","key":"10.1016\/j.microrel.2017.05.028_bb0135","doi-asserted-by":"crossref","first-page":"51","DOI":"10.1016\/0924-4247(92)80139-T","article-title":"Anisotropic etching of silicon in TMAH solutions","volume":"34","author":"Tabata","year":"1992","journal-title":"Sensors Actuators A Phys."},{"key":"10.1016\/j.microrel.2017.05.028_bb0140","series-title":"Electrochemistry of Silicon and Its Oxide","author":"Zhang","year":"2001"},{"issue":"1","key":"10.1016\/j.microrel.2017.05.028_bb0145","doi-asserted-by":"crossref","first-page":"43","DOI":"10.1016\/S0924-4247(97)80223-3","article-title":"Micromachined thermally isolated circuits","volume":"58","author":"Klaassen","year":"1997","journal-title":"Sensors Actuators A Phys."},{"issue":"1\u20134","key":"10.1016\/j.microrel.2017.05.028_bb0150","doi-asserted-by":"crossref","first-page":"547","DOI":"10.1016\/S0167-9317(00)00375-0","article-title":"Microstructures etched in doped TMAH solutions","volume":"53","author":"Birda","year":"2000","journal-title":"Microelectron. Eng."},{"issue":"2\u20133","key":"10.1016\/j.microrel.2017.05.028_bb0155","doi-asserted-by":"crossref","first-page":"510","DOI":"10.1016\/j.sna.2003.11.013","article-title":"Silicon anisotropic etching without attacking aluminium with Si and oxidizing agent dissolved in TMAH solution","volume":"114","author":"Fujitsuka","year":"2004","journal-title":"Sensors Actuators A Phys."},{"key":"10.1016\/j.microrel.2017.05.028_bb0160","unstructured":"Mentor Graphics \u2013 Mechanical Analysis Division, T3ster, https:\/\/www.mentor.com\/products\/mechanical\/micred\/t3ster\/options"},{"key":"10.1016\/j.microrel.2017.05.028_bb0165","series-title":"Proceedings of the 21st IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'05)","first-page":"135","article-title":"Thermal characterization of a radial micro-channel cooling plate","author":"Bogn\u00e1r","year":"2005"},{"key":"10.1016\/j.microrel.2017.05.028_bb0170","series-title":"Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS\/MOEMS (DTIP'05)","first-page":"227","article-title":"Thermal characterisation of a radial-channel micro-cooler plate","author":"Horv\u00e1th","year":"2005"},{"issue":"2","key":"10.1016\/j.microrel.2017.05.028_bb0175","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1088\/0960-1317\/20\/2\/025004","article-title":"High-aspect-ratio metal microchannel plates for microelectronic cooling applications","volume":"20","author":"Yu","year":"2010","journal-title":"J. Micromech. Microeng."},{"issue":"2","key":"10.1016\/j.microrel.2017.05.028_bb0180","doi-asserted-by":"crossref","first-page":"167","DOI":"10.1115\/1.2721089","article-title":"Cross-verification of thermal characterization of a microcooler","volume":"129","author":"Koh\u00e1ri","year":"2007","journal-title":"J. Electron. Packag."},{"key":"10.1016\/j.microrel.2017.05.028_bb0185","series-title":"Fundamentals of Thermal-Fluid Sciences","author":"Yunus","year":"2004"},{"issue":"12 A","key":"10.1016\/j.microrel.2017.05.028_bb0190","doi-asserted-by":"crossref","first-page":"1202","DOI":"10.1016\/j.mejo.2015.10.014","article-title":"Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s)","volume":"46","author":"Tak\u00e1cs","year":"2015","journal-title":"Microelectron. J."},{"key":"10.1016\/j.microrel.2017.05.028_bb0195","series-title":"Proceedings of the 23rd SEMI-THERM Symposium (SEMI-THERM'07)","first-page":"200","article-title":"Modeling air-cooled heat sinks as heat exchangers","author":"Moffat","year":"2007"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S002627141730166X?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S002627141730166X?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2018,9,1]],"date-time":"2018-09-01T02:51:43Z","timestamp":1535770303000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S002627141730166X"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,12]]},"references-count":39,"alternative-id":["S002627141730166X"],"URL":"https:\/\/doi.org\/10.1016\/j.microrel.2017.05.028","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2017,12]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Fabrication and characterization of microscale heat sinks","name":"articletitle","label":"Article Title"},{"value":"Microelectronics Reliability","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.microrel.2017.05.028","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2017 Elsevier Ltd. All rights reserved.","name":"copyright","label":"Copyright"}]}}