乐胖代购免代理版

{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,14]],"date-time":"2024-09-14T18:29:03Z","timestamp":1726338543949},"reference-count":28,"publisher":"Elsevier BV","issue":"3","license":[{"start":{"date-parts":[[2008,3,1]],"date-time":"2008-03-01T00:00:00Z","timestamp":1204329600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2008,3]]},"DOI":"10.1016\/j.microrel.2007.06.008","type":"journal-article","created":{"date-parts":[[2007,8,14]],"date-time":"2007-08-14T11:23:14Z","timestamp":1187090594000},"page":"416-424","source":"Crossref","is-referenced-by-count":212,"title":["Growth behavior of Cu\/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging"],"prefix":"10.1016","volume":"48","author":[{"given":"C.J.","family":"Hang","sequence":"first","affiliation":[]},{"given":"C.Q.","family":"Wang","sequence":"additional","affiliation":[]},{"given":"M.","family":"Mayer","sequence":"additional","affiliation":[]},{"given":"Y.H.","family":"Tian","sequence":"additional","affiliation":[]},{"given":"Y.","family":"Zhou","sequence":"additional","affiliation":[]},{"given":"H.H.","family":"Wang","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/j.microrel.2007.06.008_bib1","series-title":"Wire bonding in microelectronics, materials, processes, reliability, and yield","author":"Harman","year":"1997"},{"issue":"2","key":"10.1016\/j.microrel.2007.06.008_bib2","doi-asserted-by":"crossref","first-page":"423","DOI":"10.1109\/95.390327","article-title":"Optimization of copper wire bonding on Al\u2013Cu metallization","volume":"18","author":"Nguyen","year":"1995","journal-title":"IEEE Trans Comp Pack Manuf Technol"},{"key":"10.1016\/j.microrel.2007.06.008_bib3","doi-asserted-by":"crossref","first-page":"39","DOI":"10.1016\/S1044-5803(03)00102-5","article-title":"Grains, deformation substructures, and slips bands observed in thermosonic copper ball bonding","volume":"50","author":"Murali","year":"2003","journal-title":"Mater Charact"},{"key":"10.1016\/j.microrel.2007.06.008_bib4","doi-asserted-by":"crossref","first-page":"67","DOI":"10.1016\/S0169-4332(02)00150-2","article-title":"Corrosion study at Cu\u2013Al interface in microelectronics packaging","volume":"191","author":"Tan","year":"2002","journal-title":"Appl Surf Sci"},{"issue":"2","key":"10.1016\/j.microrel.2007.06.008_bib5","doi-asserted-by":"crossref","first-page":"637","DOI":"10.1016\/S0025-5408(03)00004-7","article-title":"An analysis of intermetallics formation of gold and copper ball bonding on thermal aging","volume":"38","author":"Murali","year":"2003","journal-title":"Mater Res Bull"},{"key":"10.1016\/j.microrel.2007.06.008_bib6","unstructured":"Wulff FW, Breach CD, Stephan D, et al. Characterisation of intermetallic growth in copper and gold ball bonds on aluminum metallisation. In: Proceedings of the sixth EPTC; 2004."},{"key":"10.1016\/j.microrel.2007.06.008_bib7","unstructured":"Wulff FW, Breach CD, Stephan D, et al. Further characterization of intermetallic growth in copper and gold ball bonds on aluminum metallization. In: Proceedings of SEMICON; 2005."},{"key":"10.1016\/j.microrel.2007.06.008_bib8","series-title":"Wire bonding in microelectronics","author":"Harman","year":"1989"},{"key":"10.1016\/j.microrel.2007.06.008_bib9","unstructured":"Ellis TW, Levine L, Wicen R, et al. Copper wire bonding. In: Proceedings of SEMICON conference; 2000."},{"issue":"2","key":"10.1016\/j.microrel.2007.06.008_bib10","doi-asserted-by":"crossref","first-page":"367","DOI":"10.1109\/TCAPT.2003.815121","article-title":"Effects of Cu\/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability","volume":"26","author":"Kim","year":"2003","journal-title":"Trans Comp Pack Technol"},{"key":"10.1016\/j.microrel.2007.06.008_bib11","doi-asserted-by":"crossref","first-page":"147","DOI":"10.2320\/matertrans1960.12.147","article-title":"Interdiffusion in the Al\u2013Cu system","volume":"12","author":"Funamizu","year":"1971","journal-title":"Trans Jpn Inst Metal"},{"key":"10.1016\/j.microrel.2007.06.008_bib12","doi-asserted-by":"crossref","first-page":"78","DOI":"10.1109\/95.296372","article-title":"Intermetallic compounds at aluminum to copper electrical interfaces: effect of temperature and electric current","volume":"A17","author":"Braunovic","year":"1994","journal-title":"IEEE Trans Comp Pack Manuf Technol"},{"key":"10.1016\/j.microrel.2007.06.008_bib13","first-page":"130","article-title":"Thermal and ion beam induced thin film reactions in Cu\u2013Al bilayers","volume":"B64","author":"Tamou","year":"1992","journal-title":"Nucl Instrum Method Phys Res"},{"key":"10.1016\/j.microrel.2007.06.008_bib14","doi-asserted-by":"crossref","first-page":"973","DOI":"10.1016\/j.microrel.2004.02.013","article-title":"New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al","volume":"44","author":"Breach","year":"2004","journal-title":"Microelectron Reliab"},{"key":"10.1016\/j.microrel.2007.06.008_bib15","doi-asserted-by":"crossref","first-page":"297","DOI":"10.1016\/0022-0248(80)90164-5","article-title":"A transmission electron microscopy study of intermetallic formation in aluminum\u2013copper thin film couples","volume":"49","author":"Rajan","year":"1980","journal-title":"J Crystal Growth"},{"key":"10.1016\/j.microrel.2007.06.008_bib16","doi-asserted-by":"crossref","first-page":"6923","DOI":"10.1063\/1.331999","article-title":"Interdiffusion in copper\u2013aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation","volume":"54","author":"Hentzell","year":"1983","journal-title":"J Appl Phys"},{"key":"10.1016\/j.microrel.2007.06.008_bib17","first-page":"550","article-title":"Investigation of the reliability of copper ball bond to aluminum electrodes","volume":"4","author":"Jin","year":"1987","journal-title":"IEEE Trans Comp Hybr Manuf Technol"},{"key":"10.1016\/j.microrel.2007.06.008_bib18","doi-asserted-by":"crossref","first-page":"543","DOI":"10.1016\/j.microrel.2005.05.019","article-title":"An unusual mechanical failure mode in gold ball bonds at 50\u03bcm pitch due to degradation at the Au\u2013Au4Al interface during ageing in air at 175\u00b0C","volume":"46","author":"Breach","year":"2006","journal-title":"Microelectron Reliab"},{"issue":"2","key":"10.1016\/j.microrel.2007.06.008_bib19","doi-asserted-by":"crossref","first-page":"323","DOI":"10.1007\/BF02692453","article-title":"Solid-state reaction in an Au wire connection with an Al\u2013Cu pad during aging","volume":"35","author":"Jang","year":"2006","journal-title":"J Electron Mater"},{"key":"10.1016\/j.microrel.2007.06.008_bib20","doi-asserted-by":"crossref","first-page":"1391","DOI":"10.1016\/0038-1101(70)90172-3","article-title":"Intermetallic formation in gold\u2013aluminum systems","volume":"13","author":"Philofsky","year":"1970","journal-title":"Solid State Electron"},{"key":"10.1016\/j.microrel.2007.06.008_bib21","doi-asserted-by":"crossref","first-page":"1279","DOI":"10.1007\/s11661-005-0220-2","article-title":"Bonding mechanism in ultrasonic gold ball bonds on copper substrate","volume":"A36","author":"Lum","year":"2005","journal-title":"Metall Mater Trans A"},{"issue":"3","key":"10.1016\/j.microrel.2007.06.008_bib22","doi-asserted-by":"crossref","first-page":"435","DOI":"10.1163\/156856103762864723","article-title":"Adhesional bonding of fine gold wires to metal substrates","volume":"17","author":"Takahashi","year":"2003","journal-title":"Adhes Sci Technol"},{"issue":"3","key":"10.1016\/j.microrel.2007.06.008_bib23","doi-asserted-by":"crossref","first-page":"539","DOI":"10.1109\/TCAPT.2004.831745","article-title":"Mechanical issues of Cu-to-Cu wire bonding","volume":"27","author":"Chen","year":"2004","journal-title":"IEEE Trans Comp Pack Technol"},{"key":"10.1016\/j.microrel.2007.06.008_bib24","series-title":"Chemical kinetics of solids","author":"Schmalzried","year":"1995"},{"key":"10.1016\/j.microrel.2007.06.008_bib25","unstructured":"Carr CLJ. Accelerated testing of gold\u2013aluminum ball bond. MSD dissertation, University of Waterloo, Canada; 2005."},{"issue":"19","key":"10.1016\/j.microrel.2007.06.008_bib26","doi-asserted-by":"crossref","first-page":"6125","DOI":"10.1023\/B:JMSC.0000041716.58658.0a","article-title":"Degradation of the Au4Al compound in gold ball bonds during isothermal aging in air at 175\u00b0C","volume":"31","author":"Breach","year":"2004","journal-title":"J Mater Sci"},{"key":"10.1016\/j.microrel.2007.06.008_bib27","doi-asserted-by":"crossref","first-page":"74","DOI":"10.1016\/0169-4332(91)90245-F","article-title":"Reactive diffusion in thin films","volume":"53","author":"Philibert","year":"1991","journal-title":"Appl Surf Sci"},{"key":"10.1016\/j.microrel.2007.06.008_bib28","doi-asserted-by":"crossref","first-page":"4","DOI":"10.1016\/j.msea.2004.01.065","article-title":"Diffusion induced stresses and their relaxation","volume":"387\u2013389","author":"Beke","year":"2004","journal-title":"Mater Sci Eng A"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271407002466?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271407002466?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,1,5]],"date-time":"2019-01-05T05:52:09Z","timestamp":1546667529000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271407002466"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,3]]},"references-count":28,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2008,3]]}},"alternative-id":["S0026271407002466"],"URL":"https:\/\/doi.org\/10.1016\/j.microrel.2007.06.008","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2008,3]]}}}