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ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

Resonac

Resonac

Resonac Turns to AI in New Material Exploration Tool
2024-11-22

Resonac, Soitec to Soar Power ICs With Better Material
2024-09-27

Resonac Develops New Temporary Bonding Film
2024-09-20

Resonac to Soar High With New SiC Line in Japan
2024-09-13

Resonac to Boost Innovative Tech for Best IC Materials
2024-08-15

Resonac to Lead New R&D Consortium on Chip Packaging
2024-07-09

New Japanese Facilities Roll for IC Materials
2024-05-06

Resonac Moves to Recycle Wastes from IC Production
2024-04-09
Resonac

Resonac Accelerates Capacity With New ¥15B Investments
2024-04-04

Resonac Turns to AI for Faster Material Development
2023-12-21

Resonac Eyes New Semiconductor Back End R&D Center
2023-12-15

Resonac, Matmerize Partner on 6G Materials Creation Using AI
2023-09-14

Resonac Automates Material Inspection Using Deep Learning
2023-07-24

Resonac Ramps up Production of Adhesive Film for IC Packaging
2023-04-05

Resonac Develops New Semiconductor Materials for 6G
2023-03-15

Resonac Upgrades SiC Epitaxial Wafers for Power ICs
2023-03-06

Japanese Electronic Material Firms Ramp up Capacities
2023-02-02