Taiwanese fabless semiconductor company MediaTek Inc. has flexed its muscle at COMPUTEX 2024, announcing its full suite of technologies. Specifically, Dr. Rick Tsai, CEO and Vice Chairman at MediaTek charted the company’s strategies to enable a ubiquitous AI.

Taking the keynote stage at the opening of Asia’s largest ICT event, Tsai said AI will soon be everywhere in all fields and MediaTek’s role is to ensure it will help enable in all these platforms.

“We firmly believe computing and semiconductor are at the core of this AI future…AI will be with you in your living room, TV, at your office space, when you are driving, and in all many other things,” said Tsai.

“For MediaTek, what we want to do is to enable AI in all these fields, in all these platforms.”

Tsai said the company anchors its AI strategy to four pillars. These are High-performance computing from Edge to Cloud; Leading AI Accelerator Technologies; Advanced Wireless and Connectivity for Hybrid Computing; and Strong Global Ecosystem Partnerships.

Leading-Edge Compute Power

In computing, Tsai bannered the ultimate performance and efficiency of the company’s MediaTek Dimensity portfolio. In fact, Tsai said the company’s Dimensity suite was able to make extraordinary leap in mobile computing performance. Specifically, it jumped 2.6 times in terms of CPU performance in 2024 compared to 2019. Moreover, Tsai said the company was able to achieve 6 times better GPU performance over the same period. Meanwhile, Tsai also bannered the Dimensity’s NPU performance also jumped drastically by 18 times.

Most importantly, the company’s suite also registered uncompromising power efficiency, with 60 percent less power in 2024 compared to 2019.

Dimensity 9300+ is MediaTek’s industry-leading high-performance mobile flagship computing, which Tsai said a revolutionary all-big-core CPU architecture. First, Tsai said this comes with a leading NPU performance of 68TOPS for AI computing, achieving 2293 ETHZ AI Benchmark Score. Moreover, it leads in CPU performance as well in AnTuTu benchmark, and 99FPS in GPU performance in GFXBench 1440p Aztec Ruinz Vulkan metric.

Tsai also announced its foray into the automotive field as it highlights its computing strength that will redefine the automotive of the future. Specifically, the company introduced the MediaTek Dimensity Auto Cockpit C-X1 built on NVIDIA TensorRT and CUDA RTX GPU with DLSS, RayTracking, VRS, among others. For that reason, the Dimensity Auto Cockpit C-X1 comes with cutting-edge AI performance. This as the chipset comes with 5.8 times higher TOPS, 4.5 times faster LLM performance, and 5.1 times less latency. Moreover, it also exhibits 3.2 times faster CPU performance. 

Other Technologies, Partnerships

Tsai also highlighted the company’s leading-edge capabilities for best-in-class AI accelerators. Aside from computing, he also emphasized the company’s expertise in interconnect technologies, such as SerDes, die-to-die, and UCle, as well as in 2.5/3D chiplet packaging and HBM, high-density low-power SRAM, and broad supply chain ecosystem.

In SerDes technology, Tsai divulged the company’s roadmap to achieve 400G+ in the future for the leading and best-in-class performance and power efficient interconnect technology.

Tsai also emphasized that solid industry partnerships are necessary to enable AI, mentioning companies like Google, ARM, NVIDIA, TSMC, Meta and others.

To show solid partnership, Tsai even invited on stage ARM CEO Rene Haas and NVIDIA Founder and CEO Jansen Huang, where they affirmed each other’s commitment for future collaboration and support.

04 June 2024